WebHot bump pull load cartridge invented by DAGE Industry standard 4000 Bondtester launched Series 5000 launched pioneering 25µm ultra-fine pitch Cold bump pull test patented by DAGE Patents granted on DAGE load cartridge Rotating shear load cartridge introduced 4000Plus Bondtester launched, industry first dual Bondtester and Micro-materials tester WebThe HBP (Hot Bump Pull) test process involves the following phases: Applying a test pin to the solder ball or bump under test. Heating the pin to melt and re-flow the solder onto the …

Bond Testing

WebJul 2, 2024 · the drop impact test, bending test, hot bump pull (HBP), and the . cold bump pull (CBP) testing methods. As the Intermetallic Compound (IMC) layer is known to be the . WebJan 1, 2011 · Shear speeds ranged from a conventional 0.0001 m/s (100 μm/s) rate up to as high as 4 m/s, while pull testing ranged from speeds of 0.0005 m/s (500 μm/s) to 1.3 m/s. https provisioning ascension health

4000 Plus Bondtester

WebData is presented on the intermetallic strengths and failure modes of two bond pull test methods. Specifically Hot Bump Pull (HBP) and Cold Bump Pull (CBP) testing are compared where Cu is added by the copper pins of the HBP tester or by Cu power in a second reflow followed by CBP testing. WebJan 1, 2011 · Hot and cold solder ball pull testing has emerged as an attractive alternative to the traditional ball shear method for characterizing the attachment strength of solder … WebSep 14, 2011 · Occasions may arise where shear testing is the most appropriate, but most pad cratering scenarios are best represented by so-called Hot Bump Pull at an angle of about 30° to the pad normal. Replacing the solder balls by paste deposits or pulling in a direction normal to the pad may lead to a different ranking of materials and otherwise … https protect users from phishing attack